I.C.T Lyra SMT Reflow Oven with CBS Function

PCB Reflow Oven
Reflow Oven
Reflow Oven
SMT line
Reflow Oven
PCB Reflow Oven
Reflow Oven
Reflow Oven
SMT line
Reflow Oven

I.C.T Lyra SMT Reflow Oven with CBS Function

    • Center Board Support: CBS function enhances stability for circuit boards during the reflow soldering process, ensuring optimal soldering results.
    • Flexible Modular Design: The I.C.T-Lyra Series SMT Reflow Oven boasts customizable heating and cooling zones, enabling versatile production setups tailored to specific requirements.
    • Optimal Heat Transfer: Ensure exceptional soldering quality and improved yields with the oven’s advanced heat transfer technology, optimizing soldering results.
    • Efficient Cooling System: Enhance productivity with quicker cycle times and heightened throughput, thanks to precise temperature control and cutting-edge cooling capabilities.

Overview

SMT Reflow Oven

I.C.T-Lyra Series SMT Reflow Oven

The I.C.T-Lyra Series SMT Reflow Oven, a pinnacle of cutting-edge technology in the surface mount technology (SMT) industry. Crafted with Nitrogen Standard, this reflow Soldering Machine offers the flexibility for customers to integrate nitrogen at any point, ensuring optimal soldering conditions. With 26 years of industry expertise, I.C.T brings unparalleled knowledge to the table, offering on-site installation, training, and round-the-clock customer service.

I.C.T Lyra series reflow soldering system featuring the innovative Center Board Support (CBS) function. Designed to provide additional stability for circuit boards, CBS ensures precise alignment and support throughout the reflow soldering process. This advanced feature not only minimizes the risk of board deformation but also enhances soldering quality and reliability, making it an indispensable tool for high-quality electronics manufacturing.

The Lyra series SMT Reflow Oven is not just a product; it’s a commitment to staying ahead of market demands and enhancing customer competitiveness. With a focus on innovative design and adaptability, it’s perfectly suited for various industries including communications, automotive electronics, home appliances, and consumer electronics. Experience accuracy, economy, and ease of assembly with our vision-guided DIY kit and open-source software, backed by highly trained experts ready to support your production needs.

Key Features

1-1 Reflow Oven Lyra - Structural concept

  • Nitrogen Standard Construction: Each Lyra SMT Reflow Oven is constructed with Nitrogen Standard, allowing customers the flexibility to integrate nitrogen at any point in the future.
  • Enhanced Guide Rail Design: Featuring a special guide rail design, Lyra ensures that the guide rail remains free from deformation, ensuring smooth and precise movement of components during the soldering process.
  • Chamber Design for Heat Control: The chamber is designed with a hole-free construction to prevent heat leakage, thereby ensuring accurate temperature control throughout the soldering process.
  • Enhanced Safety Measures: All electrical components and connection points within the oven are suspended, enhancing safety and minimizing the risk of electrical hazards.
  • Robust Motor Protection: Lyra incorporates a robust motor protection design, preventing motor seizing caused by excessive flux, ensuring consistent and reliable operation.
  • Precise Process Control and Reliability: Lyra offers precise process control and reliability with a loading effect of less than 2K, ensuring consistent soldering results.
  • Optimized Transmission Speed and Frequency: With a transmission speed of 87.5 cm/min and a motor frequency of 35Hz, Lyra ensures efficient soldering processes.
  • Thermal Uniformity and Heat Balance: Lyra provides excellent thermal uniformity capacity (CI = 2.0 ℃) and heat balance capacity (Φ = 24.5 ℃ – 27 ℃), ensuring consistent and uniform heating across all components.
  • Efficient Flux Management System: Lyra’s flux management system effectively manages residue and reduces nitrogen consumption, optimizing soldering performance and reducing operational costs.
  • Versatile Cooling System: The cooling system of Lyra offers versatility, allowing for both water cooling and air cooling interchangeability, providing flexibility to adapt to varying production requirements.

Description

1-2 Reflow Oven Lyra - Structural concept1-3 Reflow Oven Lyra - Structural concept

Structural Design Built for Stability and Efficiency

This reflow oven machine is designed with a nitrogen-capable structure and a widened internal chamber (over 700mm), offering a larger process window for complex SMT production. The separation between internal and external structures enhances heat isolation and improves long-term reliability, which is particularly beneficial in high-volume operations.

The oven body features a sealed design with minimal openings to improve insulation and reduce contamination risks. For companies looking to buy reflow oven solutions that balance performance and durability, this structural concept offers a solid foundation for consistent production quality.

2-1 Reflow Oven Lyra - Nitrogen system2-2 Reflow Oven Lyra - Nitrogen system2-3 Reflow Oven Lyra - Nitrogen system2-4 Reflow Oven Lyra - Nitrogen system

Reliable Nitrogen System for Controlled Processing

A stable nitrogen environment is essential for advanced soldering, and this vapour phase reflow oven is built to maintain low oxygen concentration with minimal nitrogen consumption. Its sealed design ensures long-term consistency, and the system includes real-time nitrogen detection, inlet/outlet recycling, and support for effective gas circulation.

Conforming to IPC-7530 and JEDEC J-STD-020C standards, this nitrogen system supports precise control throughout preheating, soldering, and cooling stages. For SMT reflow oven manufacturers and end users alike, it provides the process integrity needed for high-reliability solder joints.

3-1 Reflow Oven Lyra - Transport system3-2 Reflow Oven Lyra - Transport system3-3 Reflow Oven Lyra - Transport system
3-4 Reflow Oven Lyra - Transport system3-5 Reflow Oven Lyra - Transport system3-6 Reflow Oven Lyra - Transport system

Precision Transport System for Smooth PCB Handling

The transport mechanism in this reflow oven machine is engineered for long-term accuracy and operational reliability. A fully parallel transport system reduces the risk of board warping or misalignment, while the guide rail is designed to resist deformation over time. Width adjustment is simple and repeatable, ensuring compatibility with a wide range of PCB sizes.

With drive components located outside the process chamber and segmented guide rail design, this transport system minimizes maintenance and avoids jamming. It is suitable for various track configurations, offering the flexibility that many SMT reflow oven manufacturers require for modern production environments.

5-1 Reflow Oven Lyra - Profile

Controlled Heating Profiles for Repeatable Results

The heating system offers stable thermal performance through precise airflow control and insulation. By supporting both saddle and linear temperature profiles, the oven accommodates different product types and soldering needs. This flexibility helps reduce defects such as tombstoning and ensures uniform temperature distribution across all components.

The option to manage top and bottom flow speeds independently adds another level of control. Whether you’re producing dense boards or double-sided assemblies, this system enables consistent results. For users planning to buy reflow oven solutions

Specification

ModelLyra 622Lyra 733Lyra 933
Quantity of preheating zones679
Quantity of peak zones233
Max. soldering temperaturePre-heating zones 300 °C and peak zones350 °C
Quantity of cooling zones223
Mesh WidthStandard 440mm( Option 560 & 680mm )
Rail WidthSingle Rail: 50 – 460mm, Option: 50 – 686mm other Width on request. Dual Rail Standard: 50 – 290mm*2
Dimensions5150*1400*1500mm6250*1400*1500mm6950*1400*1500mm
Weight2600 kg3000 kg3400 kg

* If further parameters are required, please feel free to contact us for additional details.

Customer Case

SMT Line 12 Reflow Oven + Hanwha Pick and Place + SPI + PrinterSMT Line 11 Unloader + AOI + Reflow OvenSMT Line 17 Dispensing Machine + Hanwha Pick and Place + Curing Oven + Belt Line
PCB Cleaning MachinePCB Coating Line (14) + Vertical Curing OvenSMT line (15) Printer + Hanwha Pick and Place + Lyra Reflow Oven

 

Customer Support

Good feedback 06Good feedback 07Good feedback 10

Certificate

I.C.T Product Certification

ISO9001, ISO14001, CE, and RoHS

I.C.T’s factory is certified with ISO9001 and ISO14001 standards.

Every product they design, including SMT Reflow Oven, meets the requirements for CE safety certification.

Some of the accessories also come with RoHS certification.

I.C.T Factory & Team

I.C.T Factory 1I.C.T Team 4

DownLoad

I.C.T Catalog, File Size: 4MB

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Honored Clients.pdf, File Size: 10MB

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FAQ

1. What is the Center Board Support (CBS) function in reflow soldering?

2. Why is the Center Board Support (CBS) function important in reflow soldering?

3. How does the Center Board Support (CBS) function work?

4. When should I use the Center Board Support (CBS) function?

5. Can the Center Board Support (CBS) function be adjusted for different PCB sizes?

6. What are the benefits of using Lyra Center Board Support (CBS) function?

Consult with Us Today

I.C.T offers overall 0-1 SMT machine solution for whole factory. Our top-notch service, online support, and cutting edge engineering ensure high quality processes. Committed to excellent service, we maximize production line productivity with outstanding quality driven by lean processes, employee integration, proactive planning, and continuous improvement.

Your Free Professional Consultation

By consulting with us today, you can receive one hour of free online professional consultation with a top-tier SMT engineer with 24 years of experience. Don’t miss this opportunity to enhance your production efficiency and quality!

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