Ultra-Precise Linear Motor Transmission for Consistent Dispensing Accuracy
The I.C.T SMT solder paste dispenser features a high-performance XY linear motor drive system that delivers exceptional accuracy during high-speed operation. With a positioning precision of ±5μm and dynamic accuracy of ±3μm, this robust transmission structure ensures flawless performance even under demanding production speeds. The load-type gantry structure adds to its rigidity, maintaining stability throughout long production cycles. Whether you’re dispensing ultra-fine solder dots or complex IC patterns, the reliable structure gives consistent repeatability with minimal maintenance. This design makes it ideal for next-gen manufacturing applications requiring ultra-high accuracy. If you’re looking for a dependable solder paste dispenser machine built for precision, I.C.T delivers it.
Vision-Guided High-Speed Compensation to Eliminate Dispensing Errors
The built-in vision system operates continuously at high speed, enabling automatic compensation for deviations in chip height and position. Capable of detecting up to 100 chips per second, the system rapidly corrects coating paths and glue volume through intelligent dual-compensation logic. This feature reduces waste and increases coating quality, especially in ultra-dense SMT layouts. Additionally, the dual-camera monitoring system allows real-time penetration checks, ensuring that materials are deposited correctly underneath flip-chips. If you need next-level performance from your smt dispensing machine, the I.C.T vision system will take your production quality to new heights.
Vision non stop
Flexible Configuration for Diverse Materials and Applications
The I.C.T High Precision Dispensing System adapts to a wide range of dispensing needs by supporting multiple valve options. Screw valves handle high-viscosity glue and solder paste, while jet valves are ideal for more fluid materials. The system supports minimum dot sizes as small as 110μm—perfect for micro-components like ICs and BGAs. Applications include semiconductor packages, mini-LEDs, PCBs, and LED back-end processes. With smart alignment, AOI feedback, and volume calibration options, this High Precision Dispensing System is engineered to meet the challenges of 5G, AI, and IoT-era electronics assembly. It’s an essential upgrade for manufacturers demanding speed, accuracy, and adaptability.
